Semiconductors

A high-performance material offering exceptional releasability in the encapsulation (molding) process. Fluon® ETFE Film is versatile, compatible with various package designs such as BGA, QFN, IGBT, WLP, and Exposed-die. It ensures a high yield rate, providing excellent chemical resistance against acids and bases—critical for semiconductor manufacturing.

Fluon® is AGC’s advanced range of fluoropolymers known for their exceptional resistance to heat, chemicals, and weathering. These versatile materials are used across a wide range of industries, including automotive, electronics, and chemical processing, providing superior durability, non-stick properties, and low friction. Fluon® also offers excellent electrical insulation and is widely utilized in wire and cable coatings, pipes, and tubing.

Fluon® is an advanced range of fluoropolymers – ETFE, PFA, PTFE known for their exceptional resistance to heat, chemicals, and weathering. These versatile materials are used across a wide range of industries, including automotive, electronics, and chemical processing, providing a superior durability, non-stick properties, and low friction. Fluon® also offers excellent electrical insulation and is widely utilized in wire and cable coatings, pipes and tubings.

A non-flammable, thermally stable solvent with excellent solvency for processing oils, AMOLEA™ is designed for use in cleaning and other critical semiconductor applications. It is recyclable via distillation and features zero Ozone Depletion Potential (ODP) and very low Global Warming Potential (GWP). With a high Acceptable Exposure Limit (AEL) of 250 ppm, AMOLEA™ offers safe and efficient cleaning, making it a highly sustainable and effective choice for semiconductor manufacturing.

AFLAS® FFKM offers superior chemical resistance and operates under extreme temperature ranges, making it ideal for the most challenging environments. Designed for high-performance sealing applications, AFLAS® FFKM is often used in semiconductor manufacturing, pharmaceuticals, and petrochemical industries where chemical purity and durability are paramount. This material excels in providing long-lasting performance even in harsh, reactive environments.

A lightweight, flexible, and highly scratch-resistant glass that provides outstanding strength and durability. Dragontrail™ is manufactured using the float process, ensuring stable production to meet the growing global demand for cover glass in electronic devices such as smartphones, tablets, and wearables.

AGC’s silicon carbide boasts high purity, exceptional strength, low thermal expansion, and excellent resistance to both acids and heat. With over 30 years of experience as a supplier for semiconductor manufacturing furnace parts, particularly for high-temperature processes, AGC’s silicon carbide is essential for efficient and reliable semiconductor production.

AGC provides slurries and polishing solutions for CMP (Chemical Mechanical Planarization) processes. Our slurries offer high levels of flatness and defect-free performance for multi-layered semiconductor structures. We optimize these slurries for materials such as poly-Si, SiO2, SiN, and metals, ensuring high planarization and selectivity control for both front-end and back-end semiconductor processes.

AGC’s AQ series offers high-purity, high-quality synthetic fused silica glass, developed through extensive R&D in fine glass and ceramics. This material is ideal for semiconductor manufacturing, providing unmatched clarity and precision.

AGC’s PTFE composite materials, grounded in advanced PTFE and silicone coating processes, offer exceptional temperature resistance, non-stick properties, and chemical resistance. These materials are crucial for a variety of industries, including semiconductors, electronics, and displays.

AGC’s glass substrate is specifically designed for semiconductor packaging, offering flatness and smoothness for processes involving wafer sizes of Φ300 mm or panel sizes up to 500 mm square. This substrate is essential for maintaining precision in semiconductor packaging.

AGC provides through glass vias in thin glass substrates according to custom patterns. TGV substrates are expected to play a key role in 3D integration for semiconductor packaging and are applicable to a wide range of other fields.

AGC specializes in manufacturing aspherical glass mold lenses for various applications. The glass molding process enables high precision, mass production, and cost efficiency, making it ideal for manufacturing lenses with complex shapes and reduced defects.

AGC’s glass ceramics hybrid package (GCHP™) is designed to contribute to the brightness and high output of LED and semiconductor lasers. It’s a key material for enhancing performance in advanced lighting and laser applications.